Through-hole technology
mounting scheme used for electronic components that involves the use of leads on the components that are inserted into holes drilled in printed circuit boards and soldered to pads on the opposite side manually or by automated insertion mount machines
Through-hole technology is a way to mount electronic components to printed circuit boards (PCB).
It involves the use of leads on the components that are inserted into holes drilled in the PCBs and soldered to pads on the opposite side either by manual assembly (handiwork) or by the use of automated insertion mount machines.[1][2]
Many parts made for through hole mounting are larger than those for surface-mount technology.
References
change- ↑ Electronic Packaging:Solder Mounting Technlogies in K.H. Buschow et al (ed), Encyclopedia of Materials:Science and Technology, Elsevier, 2001 ISBN 0-08-043152-6, pages 2708-2709
- ↑ Horowitz, Paul; Hill, Winfield (1989). The art of electronics (2nd ed.). Cambridge [u.a.]: Cambridge Univ. Press. ISBN 978-0-52137-095-0.
